Lamination of individual circuit layers is a process which is used within the PCB industries to manufacture multilayer printed circuit boards. The process requires each layer of the multilayer assembly to be aligned to each other during the lamination cycle.

The most common methods used by the electronic industry to laminate multilayer circuits are:
• PINLAM
• MASSLAM

The MASSLAM system registers the different layers of the multilayer stack without the need for tooling pins during the lamination press process.
There are three MASSLAM bonding systems on the market.

•   Rivomat (Mechanical rivets)
•   Standard bonding system (Electrical heaters)
•   InduBond® technology (Inductive Bonding)

for more information download MASSLAM system comparisons

InduBond 130N is the new generation of the inductive bonding machines (InduBond®) from Chemplate for bonding the stack of inner layers and prepreg (insulating layers) of a multilayer printed circuits.  This allows repeatedly, safely and reliability obtaining high registration precision between the inner layers (< 10 microns) before pressing in any type of hot press. 

Click to download InduBond ® data sheet